CompactPCI

PICMG specification 2.0 R3.0 core specification, 2.1 R2.0 compliant
10-layer multilayer, impedance-controlled
Available in 3 and 6 U from 1 to 8 slots without bridge slot
System slot optionally left or right
Available in 32 and 64 bit
Hot swap capable
Utility connector for status signal

Customized adaptions are possible

CompactPCI Backplanes based on a PICMG standard (PICMG 2.0 Rev.3.0) are intended for industrial applications and environments that demand high standards due to reliability and robustness. For this purpose the classic PCI bus is converted to a 19" compliant platform.



Open 3D view in new window

DIMENSIONS

High

3. 6 U

PC Board Thickness

3,2 mm

Configuration

10 layers multilayer, impedance controlled

Slots

max. 8, without bridge slot
System slot optionally left or right

Data Size

32 and 64 Bit

Norms / Standards

PICMG-S 2.0 R3.0 Core Specification

2.1 R2.0 compliant
Hot Swap Specification
2.9 R1.0 System Management Specification

JTAG interface, 33 and 66MHz configurable (up to max. 5 slot)
Connector class 2
Power connections M4, ATX and HDD connectors



Complementary products

No items found.

Imprint

|

GTT & GTP

|

Privacy

DO YOU HAVE QUESTIONS? WE'RE HAPPY TO HELP YOU:

CompactPCI

DESCRIPTION

3D Ansicht

Details

Download

SUPPORT REQUEST

DATA SHEET

GENERAL OVERVIEW

GENERAL OVERVIEW

Produktgruppe

download portal

Complementary products

DO YOU HAVE QUESTIONS? WE'RE HAPPY TO HELP YOU:

Download Login:

Download PORTAL

Newsletter

Subscribe & stay informed:

CompactPCI

DESCRIPTION

3D Ansicht

Details

Download

SUPPORT REQUEST

DATA SHEET

GENERAL OVERVIEW

GENERAL OVERVIEW

Produktgruppe

download portal

Complementary products